•Papa metala
• Hoʻolālā paʻa paʻa ʻia
•Hoʻohui kiʻekiʻe i loko o ka hoʻolālā hale
• nā mākēneki puka hiki ke hoʻololi
• PC mea hoʻokahi-manawa wela kaomi hoʻoheheʻe: kiʻekiʻe wela / haʻahaʻa wela kū'ē, kū'ē kū'ē
•Kina metala a me ke kaʻina hana pena: primer+color paint+varnish glaze
•Uena paʻa puka
• Nā manamana lima Semiconductor
•Ka hoʻokomo ʻana i ka pale paʻi
• ka polokalamu wehe puka no kāu kelepona
•Ka helu helu e wehe i ka puka
•Hiki ke kūkulu hou ʻia
• He kūpono no nā ʻohana, nā villa, nā hōkele, nā keʻena, nā hale hoʻolimalima
Hōʻike: | |
Nui laka waho | 335*76*25 |
Mea papa | kiʻekiʻe kiʻekiʻe alumini alumini |
ʻenehana ʻili | ʻO ka pahu pahu + electrophoresis |
Hoʻopili i ke kino laka | 6052,6068 |
Pono mānoanoa o ka puka | 40-110mm |
Poʻo laka | Laka mīkini papa Super B |
Hana wela | -20°C-+60°C |
ʻano hana pūnaewele | Bluetooth、ʻO Lora、Nb-iot(koho i hoʻokahi mai ʻekolu) |
ʻano hoʻolako mana | 4 mau ʻaniani alkaline |
ʻO ka pumehana uila haʻahaʻa | 4.8V |
ʻO kēia manawa kū | 60μm |
Ke hana nei i kēia manawa | <200mA |
Wehe i ka manawa | ≈1.5s |
ʻAno kī | Kiʻi hoʻopā kaha |
ʻAno poʻo manamana lima | Semiconductor(ZFM-10)<0.001%<1.0% |
FFR | <0.001% |
FAR | <1.0% |
Ka helu o nā ʻōlelo huna | Kākoʻo i nā pūʻulu 150 (ʻōlelo huna palena ʻole) |
ʻAno kāleka | Kāleka M1 |
Ka helu o nā kāleka IC | 200 pepa |
ʻO ke ala e wehe ai i ka puka | App, Code, IC kāleka, Mechanical kī |
ʻOkoʻa | Tuya, TTLOCK、ʻO Lora、Nb-iot(koho i hoʻokahi mai ʻehā) |