Laka Puka Naauao- Laka Semi-akomi
Laka Puka Naauao- Laka Semi-akomi
kikoʻī huahana
• Pākuʻi metala (kiʻekiʻe kiʻekiʻe alumini alumini)
• Hoʻolālā paʻa paʻa ʻia
• Kiʻekiʻe hoʻohui i loko o ka hoʻolālā hale
• Nā mākēneki puka hiki ke hana
• PC mea hoʻokahi-manawa wela kaomi hoʻoheheʻe: kiʻekiʻe wela / haʻahaʻa wela kū'ē, kū'ē kū'ē
• Ke kaʻina hana pena metala a me ke kaʻina hana pena: primer + pena kala + varnish glaze
• Uena paʻa puka
• Nā manamana lima Semiconductor
• Hoʻokomo ʻia ka pālima
• ka polokalamu wehe puka no kāu kelepona
• Helu helu e wehe i ka puka
• Hiki ke kūkulu hou ʻia
• He kūpono no nā ʻohana, nā villa, nā hōkele, nā hale noho, nā hale hoʻolimalima
| Hōʻike: | |
| Nui laka waho | 250*58*25 |
| Mea papa | kiʻekiʻe kiʻekiʻe alumini alumini |
| ʻenehana ʻili | ʻO ka pahu pahu + electrophoresis |
| Hoʻopili i ke kino laka | 5050,Elelo hoʻokahi |
| Pono mānoanoa o ka puka | 40-110mm |
| Poʻo laka | Laka mīkini papa Super B |
| Hana wela | -20°C-+60°C |
| ʻano hana pūnaewele | Bluetooth |
| ʻano hoʻolako mana | 4 mau ʻaniani alkaline |
| ʻO ka pumehana uila haʻahaʻa | 4.8V |
| ʻO kēia manawa kū | 60μm |
| Ke hana nei i kēia manawa | ＜200mA |
| Wehe i ka manawa | ≈1.5s |
| ʻAno kī | Kiʻi hoʻopā kaha |
| ʻAno poʻo manamana lima | Semiconductor(ZFM-10)<0.001%<1.0% |
| FFR | <0.001% |
| FAR | <1.0% |
| kaha manamana lima | 120 pūʻulu (hoʻonui hiki ke hoʻololi ʻia) |
| Ka helu o nā ʻōlelo huna | Kākoʻo i nā pūʻulu 150 (ʻōlelo huna palena ʻole) |
| ʻAno kāleka | Kāleka M1 |
| Ka helu o nā kāleka IC | 200 pepa |
| ʻO ke ala e wehe ai i ka puka | App, Code, IC kāleka, Mechanical kī |
| ʻOkoʻa | Tuya, TTLOCK |
E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou
